1994年3月1日

1分钟阅读

高速硅锗电子学

作者帮助创造了性能优于传统硅技术，同时又与标准制造方法兼容的电子设备

作者：伯纳德·S·梅耶森

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Bernard S. Meyerson, Steering Group vice chair, is chief innovation officer emeritus at IBM. He is a member of the U.S. National Academy of Engineering and a recipient of numerous awards for work spanning physics, engineering and business. He was the 2014–2016 chair of the World Economic Forum's Meta-Council on Emerging Technologies and the 2016–2018 chair of the Forum's Global Future Council on Advanced Materials. He remains engaged with several WEF efforts, such as "The Future of US Manufacturing" and "Innovation with a Purpose: Strengthening Food Systems through Technology."

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大众科学 Magazine Vol 270 Issue 3This article was originally published with the title “High-Speed Silicon-Germanium Electronics” in 大众科学 Magazine Vol. 270 No. 3 (), p. 62
doi:10.1038/scientificamerican0394-62
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